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 Si5515DC
Vishay Siliconix
Complementary 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
N-Channel 20
FEATURES
rDS(on) (W)
0.040 @ VGS = 4.5 V 0.045 @ VGS = 2.5 V 0.052 @ VGS = 1.8 V 0.086 @ VGS = -4.5 V
ID (A)
5.9 5.6 5.2 -4.1 -3.4 -2.9
D TrenchFETr Power MOSFETS D Ultra Low rDS(on) and Excellent Power Handling In Compact Footprint
APPLICATIONS
D Load Switching for Portable Devices
P Channel P-Channel
-20 20
0.121 @ VGS = -2.5 V 0.171 @ VGS = -1.8 V
1206-8 ChipFETr
1
S1 D1 D1 D2 D2 G1 S2 G2
D1
S2
G2 G1 Marking Code EC XXX Lot Traceability and Date Code
Bottom View
Part # Code
S1 N-Channel MOSFET
D2 P-Channel MOSFET
Ordering Information: SI5515DC-T1--E3
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
N-Channel Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa TA = 25_C TA = 85_C TA = 25_C TA = 85_C
P-Channel 5 secs Steady State
-20 "8
Symbol
VDS VGS ID IDM IS PD TJ, Tstg
5 secs
Steady State
20
Unit
V
5.9 4.2 20 1.8 2.1 1.1
4.4 3.1 0.9 1.1 0.6 -55 to 150 260
-4.1 -2.9 -15 -1.8 2.1 1.1
-3 -2.2 -0.9 1.1 0.6 W _C A
Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)b, c
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction to Ambienta Junction-to-Ambient Maximum Junction-to-Foot (Drain) t v 5 sec Steady State Steady State
Symbol
RthJA RthJF
Typical
50 90 30
Maximum
60 110 40
Unit
_C/W C/W
Notes a. Surface Mounted on 1" x 1" FR4 Board. b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. Document Number: 72221 S-41167--Rev. B, 14-Jun-04 www.vishay.com
1
Si5515DC
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250 mA VDS = VGS, ID = -250 mA VDS = 0 V, VGS = "8 V V VDS = 20 V, VGS = 0 V Zero Gate Voltage Drain Current IDSS VDS = -20 V, VGS = 0 V VDS = 20 V, VGS = 0 V, TJ = 85_C VDS = -20 V, VGS = 0 V, TJ = 85_C On-State On State Drain Currenta ID( ) D(on) VDS w 5 V, VGS = 4.5 V VDS p -5 V, VGS = -4.5 V VGS = 4.5 V, ID = 4.4 A VGS = -4.5 V, ID = -3.0 A Drain-Source On-State Drain Source On State Resistancea rDS( ) DS(on) VGS = 2.5 V, ID = 4.1 A VGS = -2.5 V, ID = -2.5 A VGS = 1.8 V, ID = 1.9 A VGS = -1.8 V, ID = -0.6 A Forward Transconductancea gf fs VSD VDS = 10 V, ID = 4.4 A VDS = -10 V, ID = -3 A IS = 0.9 A, VGS = 0 V IS = -0.9 A, VGS = 0 V N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 20 -15 0.032 0.069 0.036 0.097 0.042 0.137 22 8 0.8 -0.8 1.2 -1.2 0.040 0.086 0.045 0.121 0.052 0.171 S W 0.4 -0.4 1.0 -1.0 "100 "100 1 -1 5 -5 A mA V
Symbol
Test Condition
Min
Typ
Max
Unit
Gate-Body Gate Body Leakage
IGSS
nA
Diode Forward Voltagea
V
Dynamicb
Total Gate Charge Qg N-Channel VDS = 10 V, VGS = 4.5 V, ID = 4.4 A P-Channel VDS = -10 V VGS = -4.5 V ID = -3 A 10 V, 4 5 V, 3 N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Channel VDD = 10 V, RL = 10 W ID ^ 1 A, VGEN = 4.5 V, RG = 6 W P-Channel VDD = -10 V, RL = 10 W 10 V ID ^ -1 A, VGEN = -4.5 V, RG = 6 W 1 4.5 N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch IF = 0.9 A, di/dt = 100 A/ms IF = -0.9 A, di/dt = 100 A/ms N-Ch P-Ch 5 5.5 0.85 0.91 1 1.6 20 18 36 32 30 42 12 26 45 30 30 30 55 50 45 65 20 40 90 60 ns 7.5 8.5 nC
Gate-Source Gate Source Charge
Qgs Qgd d td( ) d(on) tr td( ff) d(off) tf trr
Gate-Drain Gate Drain Charge
Turn-On Turn On Delay Time
Rise Time
Turn-Off Turn Off Delay Time
Fall Time Source-Drain Reverse Recovery Time
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%, b. Guaranteed by design, not subject to production testing.
www.vishay.com
2
Document Number: 72221 S-41167--Rev. B, 14-Jun-04
Si5515DC
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
20 VGS = 5 thru 2 V 16 I D - Drain Current (A) I D - Drain Current (A) 16 20 TC = -55_C 25_C
N-CHANNEL
Transfer Characteristics
12
1.5 V
12 125_C 8
8
4 1V 0 0 1 2 3 4 5 VDS - Drain-to-Source Voltage (V)
4
0 0.0
0.4
0.8
1.2
1.6
2.0
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.10 r DS(on) - On-Resistance ( W ) 800 700 C - Capacitance (pF) 0.08 600 500 400 300 200 VGS = 4.5 V 100 0.00 0 4 8 12 16 20 0 0 Crss 4
Capacitance
Ciss
0.06 VGS = 1.8 V 0.04 VGS = 2.5 V
0.02
Coss
8
12
16
20
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 4.4 A 4 rDS(on) - On-Resiistance (Normalized) 1.4 1.6
On-Resistance vs. Junction Temperature
VGS = 4.5 V ID = 4.4 A
3
1.2
2
1.0
1
0.8
0 0 1 2 3 4 5 6 Qg - Total Gate Charge (nC)
0.6 -50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Document Number: 72221 S-41167--Rev. B, 14-Jun-04
www.vishay.com
3
Si5515DC
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
20 0.10
N-CHANNEL
On-Resistance vs. Gate-to-Source Voltage
I S - Source Current (A)
10
r DS(on) - On-Resistance ( W )
0.08 ID = 4.4 A 0.06 ID = 2 A 0.04
TJ = 150_C
TJ = 25_C
0.02
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 1 2 3 4 5 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Threshold Voltage
0.2 0.1 V GS(th) Variance (V) ID = 250 mA -0.0 -0.1 -0.2 -0.3 -0.4 -50 10 Power (W) 30 50
Single Pulse Power
40
20
-25
0
25
50
75
100
125
150
0 10-4
10-3
10-2
10-1 Time (sec)
1
10
100
600
TJ - Temperature (_C)
100
Safe Operating Area
IDM Limited rDS(on) Limited
10 I D - Drain Current (A)
P(t) = 0.0001
1
ID(on) Limited TA = 25_C Single Pulse BVDSS Limited
P(t) = 0.001 P(t) = 0.01 P(t) = 0.1 P(t) = 1 P(t) = 10 dc
0.1
1000
0.01 0.1 1 10 100 VDS - Drain-to-Source Voltage (V)
www.vishay.com
4
Document Number: 72221 S-41167--Rev. B, 14-Jun-04
Si5515DC
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
2 1 Normalized Effective Transient Thermal Impedance
N-CHANNEL
Normalized Thermal Transient Impedance, Junction-to-Ambient
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02
Notes: PDM t1
t2 1. Duty Cycle, D =
t1 t2 2. Per Unit Base = RthJA = 90_C/W
Single Pulse 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
2 1 Normalized Effective Transient Thermal Impedance
Normalized Thermal Transient Impedance, Junction-to-Foot
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10-4 10-3 10-2 10-1 Square Wave Pulse Duration (sec) 1 10
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
15 VGS = 5 thru 3 V 12 I D - Drain Current (A) 2.5 V I D - Drain Current (A) 12 25_C 9 15
P-CHANNEL
Transfer Characteristics
TC = -55_C
9 2V
125_C 6
6
3
1.5 V 1V 0 1 2 3 4 5
3
0 VDS - Drain-to-Source Voltage (V) Document Number: 72221 S-41167--Rev. B, 14-Jun-04
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
VGS - Gate-to-Source Voltage (V) www.vishay.com
5
Si5515DC
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.30 r DS(on) - On-Resistance ( W ) 0.25 VGS = 1.8 V 0.20 0.15 0.10 0.05 Crss 0.00 0 3 6 9 12 15 0 0 4 8 12 16 20 C - Capacitance (pF) 600 Ciss 400 800
P-CHANNEL
Capacitance
VGS = 2.5 V VGS = 4.5 V
200
Coss
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 3 A 4 rDS(on) - On-Resiistance (Normalized) 1.4 1.6
On-Resistance vs. Junction Temperature
VGS = 4.5 V ID = 3 A
3
1.2
2
1.0
1
0.8
0 0 1 2 3 4 5 6 7 8 Qg - Total Gate Charge (nC)
0.6 -50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
20 0.4
On-Resistance vs. Gate-to-Source Voltage
I S - Source Current (A)
10
r DS(on) - On-Resistance ( W )
0.3
TJ = 150_C
ID = 0.6 A 0.2 ID = 3 A 0.1
TJ = 25_C
1 0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 2 3 4 5 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
www.vishay.com
6
Document Number: 72221 S-41167--Rev. B, 14-Jun-04
Si5515DC
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.4 0.3 V GS(th) Variance (V) ID = 250 mA 0.2 0.1 0.0 -0.1 -0.2 -50 10 Power (W) 30 50
P-CHANNEL
Single Pulse Power
40
20
-25
0
25
50
75
100
125
150
0 10-4
10-3
10-2
10-1 Time (sec)
1
10
100
600
TJ - Temperature (_C)
100
Safe Operating Area
IDM Limited
rDS(on) Limited 10 I D - Drain Current (A)
P(t) = 0.0001
1 ID(on) Limited 0.1 TA = 25_C Single Pulse BVDSS Limited 0.01 0.1 1 10
P(t) = 0.001 P(t) = 0.01 P(t) = 0.1 P(t) = 1 P(t) = 10 dc
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02
Notes: PDM t1
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 90_C/W
t1 t2
Single Pulse 0.01 10-4 10-3 10-2 1 Square Wave Pulse Duration (sec) 10-1
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Document Number: 72221 S-41167--Rev. B, 14-Jun-04
www.vishay.com
7
Si5515DC
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2 1
P-CHANNEL
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10-4 10-3 10-2 10-1 Square Wave Pulse Duration (sec) 1 10
www.vishay.com
8
Document Number: 72221 S-41167--Rev. B, 14-Jun-04


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